Multilayer PCB
Design & Manufacturing
High-density interconnect (HDI) solutions supporting up to 4 layers. Precision-engineered for optimal signal integrity and EMI reduction in complex electronic systems.
Compact Power: The Multilayer Advantage
Our multilayer design process enables complex signal routing by utilizing internal copper layers for power and ground planes. This allows for significantly smaller board sizes while drastically improving performance for high-frequency applications.
- High Density: More components in a smaller footprint using dual internal layers.
- EMI Shielding: Internal ground planes reduce noise and electromagnetic interference.
- Signal Integrity: Controlled impedance and shorter signal paths for high-speed data.
Multilayer Technical Specifications
Premium capabilities for 4-layer HDI boards
Stackup Info
- Layer Count: 4 Layers
- Min Dielectric: 0.1mm
- Core Material: FR-4 High TG
- Prepreg: 2116, 1080 standard
Precision Vias
- Min Via Size: 0.2mm
- Blind & Buried Vias
- Micro-via technology
- Via-in-Pad (VIPPO)
Signal Integrity
- Impedance Control: Âą10%
- Differential Pair Routing
- Gold Finger Support
- Low-Dk Materials Available
Design Rules
- Min Trace/Space: 3/3 mil
- Registration: Âą0.05mm
- Solder Mask: Matte Finish
- Silkscreen: High Res White
Multilayer Lamination Process
Inner Core
Etching layers 2 & 3 on the internal core material.
Lamination
High-pressure bonding of all 4 layers with prepreg.
Outer Laser
Laser drilling for precise high-density interconnects.
Plating
Electroless copper plating for through-hole connectivity.
Final Test
Flying probe & TDR impedance testing.
Ready for Your Multilayer Project?
Get a high-precision manufacturing quote for your 4-layer PCB design. Our expert engineers will review your Gerber files for DFM optimization.