TECHNICAL SPECS
Manufacturing Excellence
From prototypes to high-volume production, our facility is equipped to handle the most complex PCB requirements.
Base Materials & Layers
- Layer Count: 1 - 4 Layers
- Materials: FR4 (Standard, High-Tg), Aluminum, Copper Base, Rogers, Teflon, Polyimide (Flex)
- Board Thickness: 0.2mm - 6.0mm
- Max Board Size: 500mm x 1100mm
- Copper Weight: 0.5oz - 10oz (Heavy Copper)
Design Precision
- Min. Trace/Space: 3mil / 3mil (0.075mm)
- Min. Drill Size: 0.15mm (Mechanical), 0.1mm (Laser)
- Aspect Ratio: 12:1
- Solder Mask Clearance: 2mil
- Impedance Control: ±5% or ±10%
Finishing & Others
- Surface Finish: HASL, Lead-Free HASL, ENIG, ENEPIG, OSP, Immersion Silver/Tin, Hard Gold
- Solder Mask Colors: Green, Blue, Red, Black, White, Purple, Yellow, Matte Green/Black
- Specialties: Blind/Buried Vias, Via-in-Pad, Edge Plating, Countersinks, Castellated Holes
| Parameter | Standard Capability | Advanced Capability |
|---|---|---|
| Min Trace Width / Space | 4 mil / 4 mil | 3 mil / 3 mil |
| Min Hole Size (Mechanical) | 0.2 mm | 0.15 mm |
| Min Laser Drill Size | 0.1 mm | 0.075 mm |
| Multilayer Stackup Tolerance | ±10% | ±5% |
| Peelable Mask | Available | Multi-location |
| Via Density | Standard | High-Density Interconnect (HDI) |